Accelerate AI-Driven Silicon Innovation with Arteris Multi-Die Solution

Download the Arteris Multi-Die Solution Brief and discover the reasons why the industry is turning to multi-die chiplet-based solutions:

  • Learn the difference between non-coherent and coherent die-to-die interconnects and homogeneous and heterogeneous multi-die use cases.
  • Find out how the Arteris Multi-Die solution derisks and accelerates chiplet-based design for both coherent and non-coherent die-to-die links using standards like AMBA CXS and UCIe 1.1 IP from ecosystem partners that’s pre-integrated and verified with Arteris Ncore coherent interconnect for faster time-to-silicon.
  • Discover how Arteris Magillem enables aggregation and disaggregation of complete designs, partitioning systems into multiple chiplets and manages complexity throughout the design process.

The Arteris Multi-Die Solution delivers foundational technology for rapid chiplet-based innovation across all markets:

  • On-chiplet connectivity for the transport of critical data – NoC IPs
    • Ncore with Multi-Die option, a cache-coherent NoC for chiplets
    • FlexGen / FlexNoC non-coherent NoC
  • Automated IP integration and chiplet assembly – Integration Software
    • Magillem Connectivity for assembly
    • Magillem Registers for hardware/software Interface
The Arteris Multi-Die Solution delivers flexible design scalability for chiplet-based systems, optimal PPA, highest quality-of-results (QoR), functional safety and broad standards support to achieve the fastest time to silicon.