Download FlexGen Multi-Die Datasheet

Improve performance and streamline multi-die design processes

FlexGen Multi-Die smart network-on-chip (NoC) IP is designed to automate the creation of high-performance NoC designs for multi-die, chiplet-based products. It leverages AI heuristics using machine-learning technology and decades of NoC IP expertise and incorporates physical and performance awareness to streamline the multi-die SoC design processes.

Automation within FlexGen Multi-Die facilitates the rapid creation and iteration of NoC topologies, providing engineers with a robust starting point for physical layout and synthesis. By automating critical tasks such as simulation, verification, and timing closure, FlexGen Multi-Die makes it easy to develop, verify and iterate non-cache-coherent, high-performance, low-power SoC interconnect configurations, whether on chip, or for chiplet-to-chiplet connections in multi-die products.

FlexGen Multi-Die makes NoC engineering expertise optional, enhancing productivity and allowing engineers to focus on innovation rather than manual interconnect adjustments. The IP supports essential industry-standard protocols and its functional safety (FuSa) option meets up to ASIL D requirements, making it suitable for safety-critical applications.

Download the data sheet to learn how FlexGen Multi-Die helps you with:

  • Automated NoC creation: FlexGen Multi-Die delivers 10 times productivity boost with up to 30% wirelength reduction, lowering latency and power consumption, compared to expert manual implementations.
  • Physical Awareness and Layout Optimization: FlexGen enhances SoC design with advanced physical awareness, optimizing layout and timing closure, improving performance, and reducing area cost.
  • Performance and Power Management: FlexGen interconnect IP optimizes SoC performance with various topologies and advanced power management capabilities, contributing to energy efficiency and battery life extension.
  • NoC transparency across chiplet-to-chiplet links: FlexGen Multi-Die delivers up to 20% better payload efficiency over industry standard physical layer connections, e.g. UCIe, compared to reverting to standard protocols like AXI, while preventing the loss of critical NoC data, including QoS controls, interrupts, wake-up flags, and observability information.
  • Functional Safety and Reliability: FlexGen provides hardware-based data protection and meets ISO 26262 functional safety standards up to ASIL D, ensuring reliability for safety-critical applications.